1 arra y c hip resistor s siz e 4 0603 arc241/ARC242 ar v241/ar v242 fea tures 4 0603 siz ed resistors in one 1206-siz ed pac kage reduced reel e xchange time lo w assemb ly costs reduced pcb area reduced siz e of final equipment higher component and equipment reliability . applica tions camcorders hand held measur ing equipment car telephones computers p or tab le r adio , cd and cassette pla y ers . description the resistors are constr ucted on a high g r ade cer amic body (aluminium o xide). inter nal metal electrodes are added at each end and connected b y a resistiv e paste which is applied to the top surf ace of the substr ate . the composition of the paste is adjusted to giv e the appro ximate resistance required and the v alue is tr immed to within toler ance , b y laser cutting of this resistiv e la y er . the resistiv e la y er is co v ered with a protectiv e coating and pr inted with the resistance v alue . finally , e xter nal end ter minations are added. f or ease of solder ing the outer la y er of these end ter minations is a lead-tin allo y . fig.1 equiv alent circuit diag r am. r1 = r2 = r3 = r4. f or dimensions see fig.3 and t ab le 3. handbook, 2 columns r1 r2 r3 r4 cca862 q uick reference d a t a r-arra y o ver vie w description v alue arc241 ar v241 ARC242 ar v242 resistance r ange 10 w to 1 m w resistance toler ance and e-ser ies 5%; e24 ser ies 1%; e96 ser ies 1%; e24/e96 ser ies t emper ature coef cient 200 10 - 6 /k 100 10 - 6 /k 200 10 - 6 /k absolute maxim um dissipation per resistiv e element at t amb =7 0 c 0.063 w maxim um per missib le v oltage 50 v (dc or rms) climatic categor y (iec 60 068) 55/155/56 basic speci cation iec 60 115-8 type termina tion technology size t olerance (%) arc241 conca v e 4 0603 5 ARC242 conca v e 4 0603 1 ar v241 con v e x 4 0603 5 ar v242 con v e x 4 0603 1
3 arr a y chip resistors siz e 4 0603 arc241/ARC242 ar v241/ar v242 functional description pr oduct c haracterization standard v alues of nominal resistance are tak en from the e24 or e96 ser ies f or resistors with a toler ance of 5% or 1%. the v alues of the e24/e96 ser ies are in accordance with iec pub lication 60 063 . limiting v alues note 1. this is the maxim um v oltage that ma y be contin uously applied to the resistor element, see iec pub lication 60 115-8 . type limiting v o l t a g e (1) (v) limiting po wer (w) arc241 50 0.063 ARC242 ar v241 ar v242 d era ting the po w er that the resistor can dissipate depends on the oper ating ambient temper ature; see fig.2. handbook, 4 columns 70 100 50 0 0 50 100 155 ccb412 - 55 t amb ( c) p max (%p r ated ) fig.2 maxim um dissipation (p max ) in percentage of r ated po w er as a function of the oper ating ambient temper ature (t amb ).
4 arr a y chip resistors siz e 4 0603 arc241/ARC242 ar v241/ar v242 mechanical d a t a mass per 100 units marking all resistors within the e24 ser ies are mar k ed with a 3-digit code and a 4-digit code f or resistors of the e96 ser ies , on the protectiv e coat to designate the nominal resistance v alue . 3- digit marking f or v alues up to 91 w the r is used as a decimal point. f or v alues of 100 w or g reater the first 2 digits apply to the resistance v alue and the third indicates the n umber of z eros to f ollo w . example 4- digit marking f or v alues up to 976 w the r is used as a decimal point. f or v alues of 1 k or g reater the first 3 digits apply to the resistance v alue and the f our th indicates the n umber of z eros to f ollo w . example type mass (g) arc241 1.1 ARC242 1.1 ar v241 0.9186 ar v242 0.9186 marking resist ance 12r 12 w 124 120 k w 000 jumper marking resist ance 12r0 12 w 1203 120 k w p a cka ge marking the pac kaging is also mar k ed and includes resistance v alue , toler ance , catalogue n umber , quantity , production per iod, batch n umber and source code . outlines t ab le 3 ph ysical dimensions; see fig.3 symbol arc241/242 ar v241 ar v242 unit v alue t ol. v alue t ol. v alue t ol. l 3.20 +0.20/ - 0.10 3.20 0.15 3.20 0.15 mm w 1.60 +0.20/ - 0.10 1.60 0.15 1.60 0.15 mm t 0.60 0.20 0.55 0.10 0.55 0.10 mm a 0.60 0.15 0.40 0.15 0.60 0.05 mm b 0.35 0.15 0.30 0.20 0.30 0.20 mm p 0.80 0.15 0.80 0.15 0.80 0.15 mm e 0.50 0.15 ---- mm g 0.50 0.15 0.30 0.15 0.30 0.15 mm c 0.10 min. 0.10 min. 0.40 0.15 mm fig.3 outlines . dimensions in mm. f or dimensions see t ab le 3. handbook, 4 columns a a a c p l a a b 103 103 a t w p l b g e g c c con v e x ter mination conca v e ter mination cca863
5 arr a y chip resistors siz e 4 0603 arc241/ARC242 ar v241/ar v242 tests and req uirements essentially all tests are carr ied out in accordance with the schedule of iec pub lication 60 115-8 , categor y lct / uct / 56 (r ated temper ature r ange: l o w er c ategor y t emper ature , u pper c ategor y t emper ature; damp heat, long ter m, 56 da ys). the testing also co v ers the requirements specified b y eia and eiaj . the tests are carr ied out in accordance with iec pub lication 60 068, recommended basic climatic and mechanical rob ustness testing procedure f or electronic components and under standard atmospher ic conditions according to iec 60 068-1 , subclause 5.3. unless otherwise specified the f ollo wing v alues apply: t emper ature: 15 ct o3 5 c relativ e humidity: 25% to 75% air pressure: 86 kp a to 106 kp a (860 mbar to 1 060 mbar). in t ab le 4 the tests and requirements are listed with ref erence to the rele v ant clauses of iec pub lications 60 115-8 and 60 068 ; a shor t descr iption of the test procedure is also giv en. in some instances de viations from the iec recommendations w ere necessar y f or our method of specifying. all solder ing tests are perf or med with mildly activ ated flux. t ab le 4 t est procedures and requirements iec 60 115-8 cla use iec 60 068-2 test method test pr ocedure req uirements arc241 ar v241 ARC242 ar v242 t ests in accor dance with the sc hedule of iec pub lication 60 115-8 4.4.1 visual e xamination no holes; clean surf ace; no visib le damage 4.4.2 dimensions (outline; see fig.3) gauge (mm) see t ab le 3 - 4.5 resistance applied v oltage (+0/ - 10%): r - r nom : max. 5% r - r nom : max. 1% r - r nom : max. 5% 10 w r < 100 w : 0.3 v 100 w r<1k w :1v 1k w r < 10 k w :3v 10 k w r < 100 k w :1 0v 100 k w r<1m w :2 5v r 1m w :5 0v 4.18 20 (tb) resistance to solder ing heat unmounted chips; 10 1s ;2 6 0 5 c no visib le damage d r/r max.: (0.5% +0.05 w ) d r/r max.: (1% +0.05 w ) 4.29 45 (xa) component solv ent resistance isoprop yl alcohol or h 2 o f ollo w ed b y br ushing in accordance with mil 202 f no visib le damage 4.17 20 (t a) solder ability unmounted chips completely immersed f or 2 0.5 s in a solder bath at 235 2 c good tinning ( 95% co v ered); no visib le damage
6 arr a y chip resistors siz e 4 0603 arc241/ARC242 ar v241/ar v242 4.7 v oltage proof on insulation maxim um v oltage (rms) dur ing 1 min ute , metal b loc k method no breakdo wn or ? asho v er 4.13 shor t time o v er load room temper ature; p = 6.25 p n ; 5 s (v 2 v max ) d r/r max.: (1% +0.05 w ) d r/r max.: (2% +0.1 w ) 4.33 bending resistors mounted on a 90 mm glass epo xy resin pcb (fr4), bending: 5 mm no visib le damage d r/r max.: (1% +0.05 w ) d r/r max.: (0.5% +0.05 w ) d r/r max.: (1% +0.05 w ) 4.19 14 (na) r apid change of temper ature 30 min utes at lct and 30 min utes at uct ; 5 cycles no visib le damage d r/r max.: (0.5% +0.05 w ) d r/r max.: (1% +0.05 w ) 4.24.2 3 (ca) damp heat (steady state) 56 da ys; 40 2 c; 93 +2/ - 3% rh; loaded with 0.01 p n d r/r max.: (3% +0.1 w ) d r/r max.: (1% +0.05 w ) d r/r max.: (2% +0.1 w ) 4.25.1 endur ance 1 000 +48 /- 0 hours; 70 2 c; loaded with p n or v max ; 1.5 hours on and 0.5 hours off d r/r max.: (2% +0.1 w ) d r/r max.: (1% +0.05 w ) d r/r max.: (2% +0.1 w ) 4.23.2 27 (ba) endur ance at upper categor y temper ature 1 000 +48/ - 0 hours; no load d r/r max.: (2% +0.1 w) d r/r max.: (1% +0.05 w ) d r/r max.: (2% +0.1 w ) 4.8.4.2 temper ature coef t cient at 20/lct/20 c and 20/uct/20 c 200 10 - 6 /k 100 10 - 6 /k 200 10 - 6 /k other tests in accor dance with iec 60 115 c lauses and iec 60 068 test method 4.17 20 (t a) solder ability (after ageing) 8 hours steam or 16 hours 155 c; unmounted chips completely immersed f or 2 0.5 s in a solder bath at 235 2 c good tinning ( 3 95% co v ered); no damage 4.6.1.1 insulation resistance v oltage (dc) after 1 min ute , metal b loc k method: 10 v r ins min.: 10 3 m w 4.12 noise iec pub lication 60 195 (measured with quantech-equipment): r 100 w max. 0.316 m v/v ( - 10 db) 100 w ARC242 ar v242
7 arr a y chip resistors siz e 4 0603 arc241/ARC242 ar v241/ar v242 other applicab le tests (jis) c 5202 7.9 endur ance (under damp and load) 1 000 +48/ - 0 hours; 40 2 c; 93 +2 /- 3% rh; loaded with p n or v max ; 1.5 hours on and 0.5 hours off d r/r max.: (3% +0.1 w ) d r/r max.: (2% +0.1 w ) eia 575 3.13 leaching unmounted chips; 60 1 s; 260 5 c good tinning; no leaching eia/is 703 4.5 load humidity 1 000 +48/ - 0 hours; 85 2 c; 85 5% rh; loaded with 0.01 p n or v max d r/r max.: (2% +0.1 w ) iec 60 115-8 cla use iec 60 068-2 test method test pr ocedure req uirements arc241 ar v241 ARC242 ar v242
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